| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for a top ring which can adjust distribution of a contact surface pressure between a polished surface of a wafer and an abrasive cloth, in a polishing device. SOLUTION: An abrasive cloth 12 is stuck to an upper surface of a turn table. A top ring 14, opposed to the turn table, is arranged in its upward. A wafer 10 is sucked to a lower surface of the top ring 14 through a packing pad 15. A plurality of circumferential directional grooves 21a to c are formed concentrically in the lower surface of the top ring 14. Hollow elastic units 23a to c are mounted on the inside of each groove 21a to c. Tubes 24a to c are connected to a back surface side of each elastic unit 23a to c, and each tube 24, passing through in a hole formed inside the top ring 14, is connected to a respectively independent compressed air source. Compressed air is supplied through each tube 24a to c to a hollow part of each elastic unit 23a to c. |
