| 摘要 |
PROBLEM TO BE SOLVED: To improve depositing efficiency and target utilizing efficiency in common with sputtering film formation for substrates different in sizes in a sputtering device of a magnetron sputtering system. SOLUTION: This device has a composition in which substrates 29a to 29c and a target are confronted with, and the target is sputtered to form thin films on the substrates, in which a pallet 201 rotating so as to face to the target is arranged in the coaxial positional relation, and the face confronted to a cathode in the pallet is fitted with three rotating substrate holders 202a to 202c at equal intervals on the same circumference. The substrates are composed of a DVD-RAM substrate, aϕ5.25 photomagnetic disk substrate and an MD substrate.
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