| 摘要 |
A method for forming a plastic package of an electronic device that is substantially without void formation is disclosed. In the method, a lead finger which is to be encapsulated in a plastic package is first deformed into various configurations such that the mold flow pattern can be modified accordingly. For instance, the tip portion of the lead finger can be formed into a U-shaped or a V-shaped bend, can be tilted to a 45 DEG slope or can be formed with U-shaped or V-shaped notch in the lead finger such that plastic flow velocity may be increased where the flow channel has been enlarged. Numerous embodiments of the present invention novel method are available for achieving similarly desirable results.
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