发明名称 |
Method and apparatus for handling element on an adhesive film |
摘要 |
A system for handling semiconductor and electronic elements secured to an adhesive surface is provided. According to one aspect of the invention, a vacuum is applied through holes in a loading base. Under the influence of the vacuum, the adhesive film is pulled down toward the loading base and stretched around a pick rod so that the adhesive film is peeled away from the element. Thus, adhesive contact between the film and the element is reduced and a vacuum pick or collet is able to lift the element from the adhesive film with minimal force applied to the surface of the element.
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申请公布号 |
US6123800(A) |
申请公布日期 |
2000.09.26 |
申请号 |
US19980128662 |
申请日期 |
1998.08.04 |
申请人 |
LUCENT TECHNOLOGIES, INC. |
发明人 |
FREUND, JOSEPH M.;PRZYBYLEK, GEORGE J.;ROMERO, DENNIS M.;STAYT, JR., JOHN W. |
分类号 |
H01L21/00;H01L21/301;H01L21/683;(IPC1-7):H01L21/301;B32B31/18 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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