发明名称 WAFER CONVEYER, WAFER POLISHER AND MANUFACTURE OF WAFER
摘要 PROBLEM TO BE SOLVED: To provide a wafer conveyer and a wafer polisher, which can mount/ demount a wafer accurately stably in a wafer hold head also efficiently polish the wafer, and a method of manufacturing the wafer. SOLUTION: This device total unit 1 is provided with a tray part 2 horizontally moved along a guide rail 6 and a wafer mounting/ demounting mechanism 4 set up under a moving direction of this tray part 2. Polishing pads S are arranged in a position in parallel to the guide rail 6. A wafer loaded in the tray part 2 relating to a wafer hold head 50 is mounted by turning a head drive part 51, opposing the wafer mounting/demounting mechanism 4 and the wafer hold head 50, also moving the tray part 2 under the wafer hold head 50, and lifting the wafer by the wafer mounting/demounting mechanism 4.
申请公布号 JP2000263433(A) 申请公布日期 2000.09.26
申请号 JP19990069336 申请日期 1999.03.15
申请人 MITSUBISHI MATERIALS CORP 发明人 KOBAYASHI TATSUNOBU;KAJIWARA JIRO
分类号 B24B37/04;H01L21/304;H01L21/677;H01L21/68 主分类号 B24B37/04
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