发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To enhance manufacture efficiency of a workpiece while suppressing a variation in polishing performance. SOLUTION: During polish of a wafer 16 by a polishing pad 11, the polishing pad 11 is given a dressing by a dress grinding wheel 21. In this case, a control arithmetic part 31, using dress drive force measured by a torque meter 24 and polishing efficiency-dress drive force function stored in a memory part 32, obtains polishing efficiency in the point of present time, to judge whether this polishing efficiency is in a predetermined range or not. In the case that the obtained polishing efficiency is out of the range, an indication is given to a dressing device 20, and a dress pressure is changed, to suppress dress efficiency in a fixed range also the polishing efficiency in a fixed range.
申请公布号 JP2000263418(A) 申请公布日期 2000.09.26
申请号 JP19990068605 申请日期 1999.03.15
申请人 HITACHI LTD 发明人 SATO HIDEMI;KOJIMA HIROYUKI;OKAWA TETSUO;NISHIGUCHI TAKASHI;KAWAMORI YUKO
分类号 B24B53/017;H01L21/304 主分类号 B24B53/017
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