| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor microvalve capable of controlling a large flow rate with a small size. SOLUTION: In a first silicon substrate 10, a first communication hole 10a penetrating therethrough in a thickness direction is formed. A closing element 23 pivotally supported to a both end of a second silicon substrate 20 through a thin flexible portion and closely contacting with a center portion of one surface of the first silicon substrate 10 corresponding to a flexure of the flexible portion 22 is provided. In the second silicon substrate 20, a second communication hole 28 is provided communicating with a space 20b formed between the flexible portion 20 and the first silicon substrate 10 even in the contact state where the closing element 23 is contacted with one surface of the first silicon substrate 10. Space 20a formed between the flexible part 22 and the first silicon substrate 10 in a contact state of the closing element 23 to one surface of the first silicon substrate 10, is communicated with the first communication hole 10a provided on the first silicone substrate 10.
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