| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulating die attach paste having excellent quick curing properties, heat resistance and wet adhesion resistance to an organic substrate by using an acrylate resin. SOLUTION: This paste comprises (A) a urethane diacrylate or methacrylate obtain by reacting a hydroxyalkylacrylic acid or methacrylic acid with a polyalkylene glycol and a diisocyanate, (B) a diacrylate and/or a methacrylate (C) a phosphate group-containing acrylate and/or a phosphate group-containing methacrylate, (D) an alkoxysilane containing an alicyclic epoxy group, (E) an organic peroxide and/or an azo compound, (F) an inorganic filler and (G) a liquid compound of the formula ROOC-(CH2)n-COOR (n is an integer of >=2; R is a >=2C alkyl group) as essential components. |
