发明名称 Temperature monitoring and calibration system for control of a heated CVD chuck
摘要 A system coupleable to a heated wafer chuck control system provides an indication that the heated chuck is operating at a temperature outside of a desired operational range. An operational temperature circuit generates an operational temperature limit signal which is reflective of a selected limit for a heated wafer chuck. An input circuit configured for coupling to a heated wafer chuck control system provides a chuck temperature signal which is reflective of the actual measured temperature of the heated chuck. A comparator circuit coupled to the operational temperature circuit and the input circuit compares the limit signal to the chuck temperature signal and provides an output signal for generating a humanly-perceptible indication of the chuck temperature status, and an interlace circuit controls other aspects of the system for turning the chuck OFF. The system includes circuitry for verifying and calibrating the operation of the control board for the heated chuck.
申请公布号 US6124793(A) 申请公布日期 2000.09.26
申请号 US19990436007 申请日期 1999.11.09
申请人 SONY CORPORATION;SONY ELECTRONICS INC. 发明人 KNUTSON, PAUL L.
分类号 C23C16/46;C23C16/52;H01L21/00;(IPC1-7):G08B17/00 主分类号 C23C16/46
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