发明名称 Optical module package and method for manufacturing the same
摘要 A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340 DEG C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240 DEG C. to 260 DEG C. for 5 minutes or more after the soldering step.
申请公布号 US6123464(A) 申请公布日期 2000.09.26
申请号 US19990247364 申请日期 1999.02.10
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 MURATA, HIDEAKI;AIKIYO, TAKESHI;ONO, KAZUTO;SAKATA, MASATO;KAZAMA, YUKIO
分类号 G02B6/42;H01S5/02;H01S5/022;H01S5/024;(IPC1-7):G02B6/36 主分类号 G02B6/42
代理机构 代理人
主权项
地址