发明名称 |
Optical module package and method for manufacturing the same |
摘要 |
A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340 DEG C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240 DEG C. to 260 DEG C. for 5 minutes or more after the soldering step.
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申请公布号 |
US6123464(A) |
申请公布日期 |
2000.09.26 |
申请号 |
US19990247364 |
申请日期 |
1999.02.10 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
MURATA, HIDEAKI;AIKIYO, TAKESHI;ONO, KAZUTO;SAKATA, MASATO;KAZAMA, YUKIO |
分类号 |
G02B6/42;H01S5/02;H01S5/022;H01S5/024;(IPC1-7):G02B6/36 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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