SUPERSONIC VIBRATION CUTTING METHOD AND APPARATUS THEREOF

摘要

PURPOSE: A method and an apparatus thereof for cutting objects suitably are provided by using supersonic vibration. CONSTITUTION: A semiconductor wafer to be cut is fixedly mounted on a die(4). A supersonic vibration rotation mechanism(12) is descended toward the semiconductor wafer. Descending of the supersonic vibration rotation mechanism(12) is stopped when cutting blades thereof reach a position in which the semiconductor wafer can be cut. The supersonic vibration rotation mechanism(12) is linearly moved and at the same time the cutting blades are rotatably driven and vibrated with supersonic wave, so as to cut the wafer.