WAFER ELECTRICAL DISCHARGE CONTROL BY WAFER LIFTER SYSTEM

摘要

PURPOSE: A wafer electrical discharge control by wafer lifter system is provided to discharge electricity an electrical charges remaining on a substrate in a plasma processing chamber. CONSTITUTION: A plasma processing chamber has a chuck configured for supporting a substrate during processing of the substrate within the plasma processing chamber. A substrate lifting arrangement for use in the plasma processing chamber includes at least one substrate engaging element movable between a first position in which the substrate engaging element does not engage the substrate and a second position in which the substrate engaging element engages the substrate and lifts the substrate off the chuck. The substrate lifting arrangement further includes an actuator coupled to the substrate engaging element. The actuator controls movement of the substrate engaging element between the first and second positions. There is further included a resistance arrangement coupled to the substrate engaging element. The resistance arrangement limits a current flowing from the substrate to ground through the resistance arrangement. The current is caused by remaining electrical charges on the substrate when the substrate is lifted off the chuck by the substrate engaging element.