发明名称 |
MULTILAYERED PRINTED WIRING BOARD |
摘要 |
PURPOSE: A multilayered printed wiring board is provided to prevent the swell of the conductor layer and the deterioration of the adhesion between the insulating resin layer and the conductor caused by remaining solvent. CONSTITUTION: A multilayered printed wiring board is a lamination of the insulating resin layer and the conductor layer upon a sheet. The conductor layer composed at least of a signal layer and a power supply layer has a lattice-like conductor pattern of the power supply layer. |
申请公布号 |
KR20000057557(A) |
申请公布日期 |
2000.09.25 |
申请号 |
KR19997005283 |
申请日期 |
1996.12.13 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ASAI, MOTOO, IBIDEN CO., LTD.;NAKAMURA, AKIHITO, IBIDEN CO., LTD. |
分类号 |
H05K1/00;H05K1/02;H05K3/18;H05K3/38;H05K3/46 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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