| 摘要 |
PURPOSE:To reduce a manufacturing cost and to enable fine pattern formation by thermocompression-bonding a prepreg on a second wiring layer in advance to laminate a prepreg cured body layer thereon and by thermocompression bonding and laminating other wiring layers, etc., on the prepreg cured body layer after a hole for a blind via hole is made pass through. CONSTITUTION:A prepreg is thermocompression-bonded on a second wiring layer L2 to laminate a prepreg cured body layer 6 and a hole Bh for a blind via hole is made pass through an obtained laminate 7. A C-stage prepreg 4C, etc., is thermocompression-bonded on the prepreg cured body layer 6 of the laminate 7 through adhesive 8 and one end of the hole Bh is blocked. Thereafter, a plating layer 5 is formed simultaneously at a part including the hole Bh for a through-hole and a hole Sh for a through-hole and a blind via hole is formed which makes a first wiring layer L1 and a second wiring layer L2 conductive. Thereby, it is possible to reduce a manufacturing cost by reducing a plating process and to realize fine pattern formation. |
