发明名称 MULTILAYER SEAMLESS BELT
摘要 PROBLEM TO BE SOLVED: To prevent unevenness in resistance by composing a semiconductor layer by including resin-coated carbon black in a synthetic resin as one surface layer, and a semiconductor layer prepared by blending carbon black not coated with the resin in a synthetic resin, as at least another layer. SOLUTION: A material, mainly composed of polybutylene terephthalate(PBT), is kneaded by an extruder to obtain the pellet. The pellet including the carbon black not coated with the resin, is used in the extruder at an inner layer side, and the pellet including the resin coated-carbon black is used in the extruder at an outer layer side. A multilayer seamless belt of 160 mm diameter and 300 mm length is obtained from an extruded molten tube. The thickness of one surface semiconductive layer is 40μm, and that of a supporting semiconductor layer is 110μm. The minimum value of the volume resistance in 20-points measurement of the obtained multilayer seamless belt is 2.2×109Ω.cm, the maximum value is 9.2×109Ω.cm, and the average is 4.7×109Ω.cm. This multilayer seamless belt is used as an intermediate transfer belt 6.
申请公布号 JP2000264475(A) 申请公布日期 2000.09.26
申请号 JP19990071651 申请日期 1999.03.17
申请人 MITSUBISHI CHEMICALS CORP 发明人 OTSU NORIHIRO;HISA HIDEYUKI;MORIKOSHI MAKOTO
分类号 B65H5/02;G03G15/02;G03G15/08;G03G15/16;G03G15/20;(IPC1-7):B65H5/02 主分类号 B65H5/02
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