发明名称 MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent leakage of electromagnetic wave to the outside in concentrated flow by providing a through hole connected to a ground layer coaxially to the outside of a signal through hole, and making radiation noise generated in signal current flow to a ground through hole by converting it to a return current. SOLUTION: A multilayer printed wiring board 1 has a four-layer structure with signal wirings 3, 4 arranged in front and rear surfaces of an insulation body 2 of resin, etc., and a ground layer 5 and a power supply layer 6 laminated in the insulation body 2. A signal through hole 7 is plated and made to pass through the insulation body 2 and connect the signal wirings 3, 4 and is formed tubular. Furthermore, a ground through hole 8 is plated to be connected to the ground layer 5 through the insulation body 2 outside the signal through hole 7 and is formed tubular. The ground through hole 8 has a clearance to the power supply layer 6 in the insulation body 2 and is not connected to the power supply layer 6. Electromagnetic wave generated in signal current flows concentrating to the through hole 8.
申请公布号 JP2000261150(A) 申请公布日期 2000.09.22
申请号 JP19990060798 申请日期 1999.03.08
申请人 OKI ELECTRIC IND CO LTD 发明人 KOBAYASHI TAKESHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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