发明名称 |
RESIST PEELING LIQUID AND PEELING METHOD OF RESIST USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To obtain a resist peeling liquid with which a resist and residue of a resist can be easily peeled and which can be rinsed only with water without corroding a wiring material or an insulating film by preparing an aq. soln. containing an oxidizing agent, chelating agent and water-soluble fluorine compd. SOLUTION: This liquid consists of an aq. soln. containing an oxidizing agent, a chelating agent and a water-soluble fluorine compd. The oxidizing agent is preferably hydrogen peroxide, and its concn. is controlled to 0.0001 to 60 wt.%. The chelating agent is preferably a phosphonic acid chelating agent, and especially preferably 1,2-propanediamine tetramethylene phosphonic acid. Its concn. is controlled to 0.01 to 5 wt.%. The water-soluble fluorine compd. is preferably ammonium fluoride and its concn. is controlled to 0.001 to 10 wt.%. The peeling liquid is used in 3 to 12 pH range. |
申请公布号 |
JP2000258924(A) |
申请公布日期 |
2000.09.22 |
申请号 |
JP19990060219 |
申请日期 |
1999.03.08 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
ABE KOJIRO;FUKUDA HIDEKI;ABE HISAOKI;MARUYAMA TAKEHITO |
分类号 |
H01L21/027;C09K3/00;C11D3/33;C11D3/36;C11D3/39;C11D3/395;C11D7/10;C11D7/60;C11D11/00;G03F7/42;H01L21/02;H01L21/311;H01L21/3213;(IPC1-7):G03F7/42 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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