Protective envelopment of electronic chip label, is carried out by e.g. pressure-bonding of extruded plastic sheets above fusion point around label, before in-mold incorporation into surface of object

摘要

Cold thermoplastic film (34, 36) is brought against the label (1). A hot film is deformed to make a recess (30) packaging the label, which is tightly enclosed. An Independent claim is included for the electronic label so produced, and a molding incorporating it. Preferred features: During film deformation, whilst above the glass transition temperature, the film is compressed or stretched to make the recess. The plastic is extruded during film advance. During deformation, the extruded film (or films) are hot rolled, above glass transition temperature, compressing in the label region. During deformation, the film(s) are at a temperature in a range 80 deg C, preferably 30 deg C, below, or preferably above, the fusion temperature. Variants based on the foregoing principles are described. An otherwise similar process sandwiches the label between thermoplastic film and a sheet of cloth.