| 摘要 |
PROBLEM TO BE SOLVED: To reduce noise generated in a transistor inverter, while miniaturizing a transistor inverter and reducing its weight and cost. SOLUTION: For example, the collector surface of a switch Q1 of upper and lower semiconductor switches Q1 and Q2 which are connected in series between the positive and negative PN poles of a DC power supply is connected directly to a cooling body 1, and the collector surface of the switch Q2 is thermally coupled to the same cooling body 1 via an insulator 2, thus reducing a floating capacity from the collector of the switch Q2 to the case of the ground and suppressing the propagation of noise.
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