| 摘要 |
<p>PROBLEM TO BE SOLVED: To stably apply a driving signal to an electron emission element and allow high quality image forming, by shortening length of a simple matrix wiring and length of a connection wiring of an electron emission element driving circuit connected with this as short as possible. SOLUTION: A conductive adhesive 5 is transferred to a bump 4 on a driving IC chip 3 and is aligned to an extraction electrode 8 on an electron source substrate 1, and then the driving IC chip 3 is mounted. Then, the conductive adhesive 5 is cured by heating and ultraviolet ray radiation, and the driving IC chip 3 is coated with resin material as a protective coat 7 to finish mounting. A conductive material 11 of a flexible cable for connecting the driving IC chip 3 with other driving circuit is connected with the extraction electrode 8 through the conductive adhesive 5, similarly to the driving IC chip 3. Thus, a dielectric component of the connecting portion between a wiring take-out portion 11 and the driving IC chip 3 is minimized, resonance frequency by a capacity component formed in a matrix wiring is increased, and thereby, a ringing waveform is avoided from being added to a driving signal.</p> |
