TAPE CARRIER FOR SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a tape carrier for semiconductor devices and manufacture thereof which is satisfactory in adhesion of a P-Ni plating layer to an Au plat ing 1 and superior in wire-bonding property. SOLUTION: This tape carrier comprises a conductor pattern layer 2 formed on the surface of a resin film 1, a P-Ni plating layer 3 formed on the conductor pattern layer 2, and an Au plating layer 4 formed on the plating layer 3. In this case, before the Au plating layer 4 is formed, it is immersed in a mixed soln. of ammonium fluoride and sodium sulfonate to reduce the P component in the surface layer of the P-Ni plating layer 3.