发明名称 SUBSTRATE TREATMENT DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a substrate treatment device on which substrate treatment liquid can be recovered efficiently and treatment defect, such as washing speckles and water marks, for example, by the adhesion of treatment liquid after treatment of substrate, is not generated. SOLUTION: In this substrate treatment device wherein substrate treatment fluid is introduced into the gap S between a fixed upper plate 1 and a fixed lower plate 2, and a substrate 6 is treated by rotating the substrate 6 retained in the gap S, the exhaust path 8 of the substrate treatment fluid is formed between the outer circumferential side face 36a of outer frame, which is the outer wall of a rotating substrate supporting part, and the inside surface 5a of the housing 5 which is provided covering the side face 36a. A rotating vane 15, to be used to enhance the discharge action of substrate treatment fluid of the exhaust path 8, is provided on the outer frame outer circumferential wall surface 36a, and a static vane 16, to be used to enhance the discharge action of the substrate treatment fluid with the coaction of the rotating vane 15, is provided on the inside of surface 5a of the housing.
申请公布号 JP2000260739(A) 申请公布日期 2000.09.22
申请号 JP19990064574 申请日期 1999.03.11
申请人 KOKUSAI ELECTRIC CO LTD;HITACHI LTD 发明人 MORITA FUMIO;OKA HITOSHI;FUJISHIRO MASATAKA;DAIROKU NORIYUKI;TANAKA YUICHIRO
分类号 H01L21/304;B08B3/10;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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