| 摘要 |
PROBLEM TO BE SOLVED: To prevent the breakage of an IC chip by pasting the reinforcement seals via an adhesive layer at a position corresponding to an area where the IC chip is mounted on the over-sheet surfaces of an IC card to cover the IC chip. SOLUTION: An IC module is covered with the spacer sheets 9 which protect the side faces of an IC chip 10 via an adhesive layer 11 and also covered with two over-sheets 8 which protect the top and under surfaces of the chip 10 via the layer 11 respectively. The reinforcement seals 16 are pasted at a position corresponding to the mounting position of the chip 10 on both outer surface sides set on both sheets 8 which are holding the chip 10 between them. Thus, the seals 16 cover the chip 10 contained in the IC card. In such a constitution, the breakage of the chip 10 can be prevented. |
