| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a silicon wafer whose mechanical strength is not reduced to an unsatisfactory degree and whose thickness is reduced. SOLUTION: This is a silicon wafer 10 wherein recesses 11 and 12 are formed over the entire regions of only one surface or both main surfaces of the wafer 10 at least excluding a peripheral portion 10a, or the recesses 11 and 12 are formed over the entire regions of only one surface or both main surfaces of the wafer 10 excluding a central portion in addition to the portion 10a. The depths d1 and d2 of the recesses 11 and 12 are the same. As a result of this arrangement, a silicon wafer can be manufactured, whose mechanical strength is not reduced to an unsatisfactory degree despite the fact that its thickness is reduced. |
