发明名称 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE MATERIAL, PRODUCTION OF RELIEF PATTERN AND PRODUCTION OF POLYIMIDE PATTERN
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive composition exhibiting superior photosensitive characteristics and shelf stability and having high resolution and good process stability, to obtain a photosensitive material exhibiting superior photosensitive characteristics, shelf stability and heat resistance and having high resolution and good process stability, to produce a relief pattern capable of giving a polyimide pattern or the like exhibiting superior heat resistance, adhesion and chemical resistance and having a good shape and to produce a polyimide pattern exhibiting superior heat resistance, adhesion and chemical resistance and having a good shape. SOLUTION: The photosensitive composition contains nitrone, a titanocene compound of the formula and an addition polymerizable compound. The photosensirive material contains nitrone, a titanocene compound of the formula and a polyimide precursor having a carbon- carbon double bond which can be dimerized or polymerized under actinic radiation. A coating film of the photosensitive composition or the photosensitive material is patternwise irradiated with active light and the unirradiated part is removed by development to produce the objective relief pattern. The relief pattern is heated to produce the objective polyimide pattern. In the formula, R1-R10 are each H, halogen, 1-20C alkoxy or a heterocyclic group.
申请公布号 JP2000258906(A) 申请公布日期 2000.09.22
申请号 JP19990064183 申请日期 1999.03.11
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 SASAKI HAN
分类号 H01L21/027;G03F7/004;G03F7/027;G03F7/029;G03F7/40 主分类号 H01L21/027
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