| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board in which individual terminal inspection of a high density integrated circuit is enabled and a space of circuit part of exclusive use for inspection does not become useless after inspection. SOLUTION: In an intermediate product in manufacturing, a high density integrated circuit 22, terminals 23 for control and power supply, individual wiring electrode terminals 24, wiring terminals 25 for inspection and a circuit 26 for inspection are formed on a substrate 21, After inspection, extended parts 14-2 of the terminals 24, heat generation resistors 34 connected with the stretching parts 24-2, and common electrodes connected with the resistors in common are formed on an upper oxide film 32 in which a passivation film 29 does not exist. The circuit 26 for inspection existing in a broken line 33 part and terminals directly belonging to the circuit 26 are eliminated by sand blasting as far as the internal part of the substrate 21 so as to hollow out the central part. An ink route trench 36 of a printing head is formed in this part. After that, a barrier wall and an orifice plate are laminated, a jet nozzle is formed and an ink feeding hole 38 is bored.
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