| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a film without employing a complicated process such as lithography or etching, to remarkably simplify its process, and to reduce its manufacturing cost by providing multiple linear conductive film wiring patterns formed on one surface or both surfaces of a film-like insulating base material and separated from one another by cracks. SOLUTION: When a material having a thin film/base material structure is pulled in one direction, both the thin film 1 and the base material 2 extend to the same extent until the pulling reaches the tensile critical strain of the thin film 1, and when the strain due to the pulling reaches the critical value of the thin film 1, cracks 3 perpendicular to the pulling direction are produced in only the thin film 1. When the pulling is further continued, the thin film 1 is pulled through shearing stress on their interface, provided that the adhesion between the thin film and the base material remains, and more cracks 3 are produced almost evenly in the surface of the thin film, and the thin film 1 is brought into a form where elongated strip-like elements are continuously arranged, so that multiple linear conductive thin film wiring patterns are formed.
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