| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device without mounting errors on a substrate by preventing cracks of resin around a support bar. SOLUTION: A surface-mount semiconductor device is provided with a die pad 3 where a semiconductor chip is sealed, a plastic package where a semiconductor chip is molded so that the reverse side of the die pad 3 can be exposed to the upper surface and at the same time a packaging surface with a substantially square lower surface is formed, an external connection lead 10, where one end is connected to the semiconductor chip in a plastic package and the other end, is bent near the lower surface of the package, so that it is exposed to the side part of a package-mounting surface 8, and a support bar 15 where one end is connected to the die pad 3 and at the same time the other end is exposed to the corner part 9 of the package-mounting surface 8. Then, the area of an exposed end part 16 of the support bar 15 is enlarged, so that it essentially occupies the corner part 9 of the package-mounting surface 8. |
