| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board showing high reliability function wherein total wiring pattern layers are connected as specified and a method of manufacturing a highly reliable multilayer wiring board assuring good manufacturing yield. SOLUTION: A multilayer wiring board comprises a plurality of wiring pattern layers 1a, 1b that are integrated via the interlayer insulation layer 2a, 2b,..., via-type connection conductor regions 3a, 3b,... for electrically connecting the wiring pattern layers 1a, 1b,... through insertion of the interlayer insulation layers 2a, 2b,..., a through hole 4 provided through the total interlayer insulation layers 2a, 2b,... and a through hole connecting part 5 formed at the internal wall surface of the through hole 4 for electrically connecting the predetermined wiring patterns 1a, 1b,.... |
