| 摘要 |
<p>PROBLEM TO BE SOLVED: To freely perform exchange in a plurality of connectable semiconductor devices, and to improve packaging density onto a packaging substrate. SOLUTION: A semiconductor device consists of a package body 4, where a semiconductor chip 1 is incorporated, and connection parts 4b that can be connected mutually are formed at an outer periphery, outer leads 2a that are provided while being exposed to the connection part 4b of the package body 4 and are electrically connected to the pad 1b of the semiconductor chip 1 corresponding to it, an inner lead 2b that is formed while being connected to the outer leads 2a, a tab 2c for supporting the semiconductor chip 1, and a bonding wire 3 for electrically connecting the pad 1b of the semiconductor chip 1 to the inner lead 2b. In this case, when a plurality of package bodies 4 are connected mechanically via the connection part 4b, the outer leads 2a can be connected so that they can be electrically connected each other and can be removed easily.</p> |
