| 摘要 |
PROBLEM TO BE SOLVED: To achieve highly reliable connection to a wiring substrate and at the same time reduce the cost. SOLUTION: In a structure, one end of a copper lead 2 is jointed to the electrode terminal of a semiconductor chip 1 via a gold bump 3, and the other end of the copper lead 2 is bonded to the end part at a junction side. Then, a flex part is formed at the middle part. Also, a resin-covered layer 5 is formed on a surface for forming the electrode terminal of the semiconductor chip 1. Then, in the device, the structure is mounted on the formation surface of a connection pad 9 of the wiring substrate, and the flex part of the copper lead 2 is connected to the connection pad 9 via a solder layer 10. |
