发明名称 MOUNTER OF CONDUCTIVE BALL AND ITS MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mounter of a conductive ball, in which the conductive balls can efficiently be mounted on a plurality of electronic components made in a sheet of semiconductor substrate, and its mounting method. SOLUTION: In a method for mounting a conductive ball for mounting conductive balls 7 on electronic components of a wafer 6, the wafer 6 is sucked and held from downwardly by a retaining part 5b of an arm 5a of a robot to be conveyed, and the conductive balls 7 are mounted in the condition in which the retaining part 5b holding the wafer 6 is retained is supported by a support table 29 of a flux supply part 4, flux is printed, and also in the condition of being supported by the support table 16 of a ball mounting part 2. Thus, it is possible to print the flux and mount the conductive balls efficiently.
申请公布号 JP2000260799(A) 申请公布日期 2000.09.22
申请号 JP19990061315 申请日期 1999.03.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAMI SEIJI
分类号 H05K3/34;H01L21/60;H01L23/12;(IPC1-7):H01L21/60 主分类号 H05K3/34
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