发明名称 FLATTENING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To flatten even a thin film that is grown on a ground with severe recesses and projections by providing a substrate where a thin film is glued onto a recessed and projecting part on a data stand and setting the substrate to a specific temperature for heating, and then applying flash light to the substrate. SOLUTION: Both of a sputter chamber 71 and a vacuum chamber 81 are evacuated, and then a substrate 30 is placed on a stand 22 in the vacuum chamber 81 from a door 82, then is heated by a heater 23 and is evacuated, and then is transferred through a valve 83 onto a stand 41 of a data stand 40 for gluing a thin film onto the recessed and projecting part of the substrate 30. After that, the substrate 30 is heated to a specific preliminary heating temperature by a heater 42 depending on the position of the substrate 30 and is finally brought closer to a flash lamp system, and flash light is applied quickly by a flash lamp 51, thus flattening even a thin film that is made of a high melt- point material growing on the ground with severe recesses and projections even if a method such as ionization is not used.
申请公布号 JP2000260773(A) 申请公布日期 2000.09.22
申请号 JP19990116910 申请日期 1999.03.10
申请人 ASAMAKI TATSUO 发明人 ASAMAKI TATSUO;NOGUCHI MITSUHIRO
分类号 H01L21/3205;C23C14/58;(IPC1-7):H01L21/320 主分类号 H01L21/3205
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