| 摘要 |
PROBLEM TO BE SOLVED: To provide a PGA(pin grid array) electronic component capable of realizing high density mounting. SOLUTION: A large number of pin-shaped electrodes 2 are protruded from the end portion of a package of a PGA electronic component 1 on which circuit components are mounted. Annular coaxial electrodes 5 are formed coaxially with the pin-shaped electrodes 2 on roots of the respective pin-shaped electrodes 2, via insulating members. Through holes 9 of a board 8 are penetrated from the surface side, by the respective pin-shaped electrodes 2 of the PGA electronic component 1. A mounting board 8 and the PGA type electronic component 1 are supplied to flow equipment, solder paste 7 is fused and solidified, and the respective lands 31 and the respective coaxial electrodes 5 are fixed with fillets 3a. The mounting board 8 and the PGA electronic component 1 are supplied to reflow equipment, the respective pin-shaped electrodes 2 exposed on the back of the board are fixed to lands 32 of the through holes 9 with fillets 3b.
|
