| 摘要 |
PROBLEM TO BE SOLVED: To enable reducing stray capacitance between semiconductor devices and a wiring board formed of metal, reduce power loss due to the stray capacitance, and make noise countermeasure practically unnecessary. SOLUTION: In this mounting structure of a semiconductor device, base electrode plates 1 on which semiconductor chips are mounted, electrode terminals extended from the base electrode plates, and one or more other electrode terminals which are connected with the respective electrodes of the semiconductor chips through bonding wires are collectively formed in an unified body by using electric insulating resin. The base electrode plates 1 are fixed on a wiring board 6 formed of metal via heat conducting adhesive films 7, heat conducting insulating plate 8 and the heat conducting adhesive films 7. Electrode terminals 2, out of a plurality of electrode terminals 2-4 which are stretched from the base electrode plates 1, are bent in a nearly upper direction to the wiring board 6 formed of metal.
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