| 摘要 |
PROBLEM TO BE SOLVED: To produce a small-diameter via hole with high accuracy at low cost by the following method: a photosensitive resin composition layer containing a photoinitiator is formed, and active or chemical ray is irradiated to an image, then a negative pattern is formed on the surface of a metallic foil by development, and finally patterning is performed by the photoetching method. SOLUTION: A photosensitive resin composition layer is formed on the surface of a metallic foil containing at least one photoinitiator selected among titanocene compounds represented by formulas. Then, photosensitive films for photoetching are laminated on both sides of a copper foil having a polyamide- imide pattern, and are exposed to light and developed to form a negative pattern. Next, the copper foil is photoetched for patterning so as to obtain a film carrier. Good adhesion between the metallic foil and film makes it possible to produce a small-diameter via hole with high accuracy. R11 through R20 in the formulas are each a hydrogen atom, a halogen atom, and an alkoxy or heterocyclic group with carbon numbers of 11-20.
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