| 摘要 |
<p>PROBLEM TO BE SOLVED: To allow cleaning in a short time by, with a holder to which a push-up pin is fitted provided, mounting/dismounting a head part deformable under elastic force from a groove part formed in the holder so that one side of the head part is fitted to the shaft on a ground side. SOLUTION: Related to the semiconductor wafer push-up mechanism, a push-up pin 3 and a shaft 8 are clamped with a holder 6 and a plug 7 in one- touch structure. The plug 7 is fixed to the shaft 8 with a screw, while the push-up pin 3 is fixed to the holder 6. The holder 6 and the plug 7 are provided with a structure for dismounting in a single action. An oval head part 8A is formed of an elastic member, one side of the head part 8A is connected to a conductive rod 8B, and the conductive rod 8B is connected to the shaft 8 on the ground side through the plug 7. Thus, a cleaning time is shortened. Further, an induction current is easy to flow, so even if an operator touches the holder 6 with a driver, etc., there is no fear of metal fine particles evaporated by spark, etc., flying to a semiconductor wafer 1.</p> |
