| 摘要 |
PROBLEM TO BE SOLVED: To prevent copper base having relatively high fusibility from directly abutting on molten solder in a solder bath by forming a nickel-plated base layer and a solder-plated layer on a copper wire, a copper alloy wire or a copper-covered wire and by carrying out soldering to a material surface through the nickel-plated base layer. SOLUTION: For this lead wire 1, a nickel-plated base layer 5 is formed on a copper wire 2, a copper alloy wire or a copper-covered wire, and a solder- plated layer 7 is formed on it as desired. The copper base layer in the copper- covered wire is relatively thick, and the element wire of the copper-covered wire is made of nickel, iron, aluminum or an alloy thereof. In the metal element wire, the iron or its alloy includes carbon steel or stainless steel, and the copper- covered wire is normally a CP or EF wire. Phosphor bronze or brass can be used as the copper alloy. The nickel-plated base layer 5 is formed by an electroplating method or an electrodeless plating method, and the plating thickness is set to 0.5-5μm, and the thinner, the better. |
