| 摘要 |
PROBLEM TO BE SOLVED: To sharply reduce the tape warpage of a tape automated bonding(TAB) tape carrier and drastically lessen the feed failures of the tape carrier, the bending failure of inner leads, the damage/defect of an IC chip, etc., when the IC package is produced using the tape carrier. SOLUTION: This tape carrier has a Cu foil 2 adhered onto a base insulating tape via adhesives 3, a wiring pattern is formed on the Cu foil 2. The foil 2 has a max. surface roughness of 6μm or less, and the coating of the adhesives 3 is 8-12μm thick. |
