发明名称 IC SOCKET AND IC MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To easily accommodate for the change in the number of ICs by installing plural contact pins whose one tip is drawn out to the inside of an IC mounting part of a socket body and the other tip is projected from the back side of the socket body to the outside, and plural pin holding holes for upper step socket connection in the position coming in contact with each contact pin. SOLUTION: In order to mount a socket body 11 on a printed board, a contact pin 12 of the socket body 11 in a first step is inserted into a pin holding hole 11b of the printed board, and a PLD is mounted on a PLD mounting part 11a. As a result of correcting a circuit on the inside of the PLD, if a circuit scale is increased and the circuit is not housed in one PLD, the contact pin 12 of the socket body 11 piled up as a second step is inserted into the pin holding hole 11b of the socket body 11 in the first step. The contact pin 12 in the second step comes in contact with a right angle bending part of the contact pin 12 of the socket body 11 in the first step, and the circuit is divided into two PLDs to be increased.
申请公布号 JP2000260545(A) 申请公布日期 2000.09.22
申请号 JP19990065650 申请日期 1999.03.11
申请人 TOSHIBA MICROELECTRONICS CORP;TOSHIBA CORP 发明人 TAKAMATSU SHIRO
分类号 H01R33/76;H01L23/32;H01R33/945;(IPC1-7):H01R33/76 主分类号 H01R33/76
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