| 摘要 |
PROBLEM TO BE SOLVED: To reduce waste of energy for melting solder bumps in flip-chip mounting and prevent a circuit board from being deformed due to heating. SOLUTION: A heater comprises a ferrite-made heater block 1, a heating coil 2A wound around the block 1, and a high-frequency power source 3 connected to the coil 2A. In the flip-chip mounting, a circuit board 4 and a semiconductor chip 5 are mounted on the heater block 1, a high-frequency current is fed to the heating coil 2A, which then generates high-frequency flux to induce eddy current in the heater block 1, thus heating the heater block 1. Since the high-frequency induction heating having a short rise time is used, solder bumps 6 are molten, and this suppresses the waste of energies except those required and also the rise of the ambient temp., thereby preventing the circuit board from being deformed due to heating.
|
