| 摘要 |
PROBLEM TO BE SOLVED: To provide a rear surface heat dissipation semiconductor resin sealed package, and a manufacturing method thereof, in which the mold resin is prevented surely from being stripped off from a rear surface heat sink or a semiconductor element. SOLUTION: A semiconductor element 12 is mounted on a rear surface heat sink 11 disposed on the mounting board 17 and a lead terminal 13 is disposed on the side of the rear surface heat sink 11. The rear surface heat sink 11, the semiconductor element 12 and the lead terminal 13 are coated with a mold resin 14 and the rear surface heat sink 11 is exposed. A bend 15 directing toward the inside of the mold resin 14 is provided at the end of the rear surface heat sink 11 and a recess 16 is made at the base point of the bend 15 on the side opposite to the mounting board 17. |
