| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC, its mounting structure, a crystal liquid device, and electronic equipment which can electrically connect a bump electrode with an electrode terminal via an anisotropic conductive film without lowering electric characteristic or reliability, even when the bump electrode is formed at a narrow pitch by improving the structure of the bump electrode. SOLUTION: Since a root part 132 of a bump electrode 130 of a drive IC 13 is fine, the root parts 132 are located away from each other in a wide space between the bump electrodes 130. Accordingly, a plurality of conductive particles 60 accumulating between the bump electrodes 130 the bump electrodes 130 short-circuiting to each other do not occur. Furthermore, since there is a large area, where an electrode terminal 16 of a second transparent substrate 2 confronts the bump electrode 130, the plurality of conductive particles 60 are interposed between the bump electrode 130 and the electrode terminal 16. Therefore, the bump electrode 130 is electrically connected efficiently to the electrode terminal 16. |
