发明名称 PROBE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent the top part of a bump electrode from breaking down by providing a recessed part opened on the extreme end face of a core wire, and covering the outer circumference of the extreme end part with an electrically conductive coating layer made of conductive material different from the core material. SOLUTION: A plating layer of different material from a core wire such as Ni or Rh, is formed on the outer circumference of the core wire 24, and hence an electrically conductive coating layer 26 is provided on the outer circumference of the core wire 24. The thickness dimension of the conductive coating layer is about 15-25μm. Next, a recessed part 28 is formed on the extreme end part by etching. The open end of the recessed part 28 is formed by the conductive coating layer 26. At testing, the extreme end of each probe 12 is pressed against a bump electrode 32. At this time, the top part of the bump electrode 32 is received in the recessed part 28, and when the needle tip is correctly conformed to the bump electrode 32, a contact trace is formed on the bump electrode 32. Even when the needle tip is a little deviated against the bump electrode 32, an eccentric contact trace is formed on the bump electrode 32. In both cases, the top part of the bump electrode 32 is not injured.
申请公布号 JP2000258457(A) 申请公布日期 2000.09.22
申请号 JP19990057269 申请日期 1999.03.04
申请人 MICRONICS JAPAN CO LTD 发明人 MIZUKI YOSHIO;SUGIYAMA TADASHI
分类号 G01R1/067;G01R1/073;H01L21/66;(IPC1-7):G01R1/067 主分类号 G01R1/067
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