| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board to form a flat and smooth substrate having through holes and conductive circuits and assuring excellent connection property and reliability by forming on the substrate an interlayer resin insulation layer and upper layer conductive circuit. SOLUTION: In this method for manufacturing a printed wiring board, a mask providing an aperture to the part overlapping with through hole 9, conductive circuit non-forming area and external edge of conductive circuit is placed on the insulated substrate 1 where through hole 9 and conductive circuit 4 are formed and the mask is then coated with a resin filler material 10 to form the layer of resin filler material into the through hole, conductive circuit non- forming area and external edge of the conductive circuit. |
