| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board that assures excellent connection and reliability by forming a smooth substrate having through holes and conductive circuits and thereby forming thereon interlayer insulation layers and upper layer conductive circuits. SOLUTION: In a method of manufacturing a printed circuit board, a mask having an aperture at the area where a conductive circuit non-forming and conductor circuit external edge are overlapped is placed on the insulated substrate, where the through holes 9 and conductive circuits are formed, the through holes 9 are filled with resin filling material 10, and this mask is coated with the resin filling material 10. As a result, a layer of resin filling material 10 is formed at the external edge area of the conductor non-forming area and conductor circuit. |
