BARREL PLATING METHOD FOR ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To obtain a barrel plating method electronic parts where even plating for whole element to be plated can be made in a simple constitution without providing a special agitating plate in a barrel for plating. SOLUTION: This device comprises a first conductive medium 17 having about same or less dimension than an original element 16 to be plated and a second conductive medium 18 having an apparently larger dimension than the element to be plated, being immersed into a barrel 14 for plating with the element 16 to be plated to make barrel plating by rotating the barrel 14.