发明名称 LOW INDUCTANCE FOUR TERMINAL CAPACITOR LEAD FRAME
摘要 <p>A chip capacitor (108) is conductively coupled to spaced-apart (i.e., non-conductively coupled) circuit traces of an integrated circuit to provide a four terminal network. The chip capacitor (108) includes a casing of dielectric material having first and second sets of electrode plates (116, 118) disposed therein, a first conductive lead frame (110) which is conductively coupled to the first set of electrode plates (116), and a second conductive lead frame (110) which is conductively coupled to the second set of electrode plates (118). The first and second lead frames (110) are, in turn, conductively coupled to the circuit traces so as to route the output (or input) current of an electronic device through the capacitor (108).</p>
申请公布号 WO2000055875(A1) 申请公布日期 2000.09.21
申请号 US1999022450 申请日期 1999.09.28
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