发明名称 |
DISTRIBUTED PARALLEL CONNECTED SEMICONDUCTOR DEVICES SPACED FOR IMPROVED THERMAL DISTRIBUTION AND HAVING REDUCED POWER DISSIPATION |
摘要 |
<p>A single triac on a heat sink is replaced by a plurality of lower rated current, parallel connected triacs for carrying the same total current as the single triac. The plural devices are spaced apart as far as possible, within the confines of an insulation back cover, to reduce the thermal gradient across the heat sink and to reduce the input thermal power to the heat sink. Thermally conductive compressive sheets thermally couple the flat heat sink to a face plate on the side of the heat sink opposite to the side receiving the triacs.</p> |
申请公布号 |
WO0055911(A1) |
申请公布日期 |
2000.09.21 |
申请号 |
WO2000US06197 |
申请日期 |
2000.03.09 |
申请人 |
LUTRON ELECTRONICS CO., INC. |
发明人 |
JACOBY, ELLIOT, G., JR.;WEIGHTMAN, RUSSELL;BILLINGTON, SCOTT, A.;SPIRA, JOEL |
分类号 |
H05B39/00;H05B39/08;H05K7/20;(IPC1-7):H01L23/34 |
主分类号 |
H05B39/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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