Waste solder material removal method for circuit boards

摘要

Removing residual solder material from circuit- board pads after desoldering and extracting electrical components from the board involves aligning a solder suction nozzle and the circuit-board in relation to the waste solder material on the circuit board by means of a three-dimensionally adjustable manipulator, followed by melting the residual solder and sucking the waste solder material from the circuit-board by the suction nozzle. The nozzle diameter of the suction nozzle is matched to the diameter of the circuit-board pads and waste solder material is drawn off each pad separately, with the nozzle adjusted over the respective pad to give a given vertical spacing from the circuit- board.